First vertical. Such shape has several practical advantages for

First Finfet-based high
performance complex logic product was Intel’s 22nm node microprocessor. It has
been built with finfet sidewalls sloping at about 8 degrees from vertical. Such
shape has several practical advantages for manufacturability of this technology
18:

–     
Fins with lower aspect ratio (height : width) are more
mechanically sturdy thus less vulnerable to damage during manufacturing process;

We Will Write a Custom Essay Specifically
For You For Only $13.90/page!


order now

–     
Sloping sidewalls assure better fill of trenches between
fins with fin isolation dielectric;

–     
Etching gate spacer off fin sidewalls is easier than
for vertical fins;

–     
Gate etch, which in finfets requires much more overetch,
is easier;

–     
Doping of source and drain extensions by implantation
is easier as sloped sidewalls are more suitable for dopant placement by
vertical or low angle tilt implants.